The BQ-P65 is ideal for low-volume document binding environments. This compact system can easily cover bind, tape bind, or pad bind in as little as four simple steps to produce professional quality books.
Consistent quality across binding styles:
When cover binding, the book block is firmly clamped to produce a high-quality book up to 0.98″ in thickness. Depending on the choice of binding style, nipping strength will be automatically adjusted for consistent finishes. Additionally, glue amounts can be easily adjusted based on book thickness.
Office-friendly operation:
The BQ-P65 features a built-in odor extractor and filter system to remove the smell of glue in the surrounding environment. The system also features a low-temperature glue and power-saving mode for energy efficiency.
Technical Specifications
Binding Type
Cover Binding, Tape Binding, Pad Binding
Glue Type
Cover Binding, Tape Binding, Pad Binding
Book Block Size
Spine Length x Fore-edge Length
Max. 315 x 210 mm or 12.4” x 8.2”
Min. 210 x 148 mm or 8.3” x 5.9”
Book Block Thickness
Max. 25mm or 0.98”
Cover Size
Length x Width
Max. 315 x 445 mm or 12.4” x 17.5”
Min. 210 x 297 mm or 8.27” x 11.70”
Cover Weight Range
82 to 210 gsm, 22 to 60 lb
Glue Temperature
130 to 150 degrees Celsius (266 to 302 degrees Fahrenheit)
Cycle Speed
22 seconds per cycle (Cover Binding)
Voltage/Frequency
Single Phase 115 V, 50 or 60 Hz
Single Phase 220 to 240 V, 50 or 60 Hz
Rated Current
Single Phase 115 V, 50 or 60 Hz, 10 A
Single Phase 220 to 240 V, 50 or 60 Hz, 5 A
Machine Dimensions
W600 x D615 x H270 mm or 23.7" x 24.3" x 10.7"
Machine Weight
48 kg or 106 lbs.
Additional Information
